HBM / Advanced Packaging
Internal inspection for stacked packages, bonding interfaces, and hidden voids in advanced semiconductor packaging.
VoidDelaminationBonding failure
Applications
Inspection use cases where internal evidence decides the next step.
HBM and advanced packaging are placed first for global semiconductor relevance, while batteries and industrial inspection remain visible as expansion markets.
Semiconductor Wafer
Wafer-level acoustic imaging for internal defects that optical inspection cannot expose.
Sub-surface crackInterface defectParticle-related anomaly
Power Semiconductor
Inspection support for modules where bonding quality and thermal reliability matter.
Die attach voidSolder delaminationInterface separation
EV Battery
Non-destructive review of internal battery structures and delamination-prone interfaces.
DelaminationSwelling-related gapLayer separation
MEMS / Electronic Components
Inspection for compact devices where physical sectioning is slow, risky, or destructive.
Package voidMicro-crackBonding anomaly
Composite Materials
Acoustic inspection for internal discontinuities in composite structures.
DelaminationImpact damageInternal crack
Pipeline / Industrial Inspection
Industrial inspection direction for pipe and infrastructure assets with custom sensing systems.
Wall thinningInternal corrosionStructural anomaly