Products
Compare OHLABS systems by inspection mode, target sample, scan range, and available scan evidence before requesting a sample review.
SAM Systems
8 products
Software
1 products
Laser Ultrasound
1 products
Ultrasound Components
4 products
Custom / Industrial Systems
2 products
Featured SAM Systems
The first screen focuses on the SAM systems with the clearest equipment role, inspection target, and scan evidence.
Transmission
Transmission SAM for seeing internal layers clearly across a wide range of samples and frequencies.
Double-sided
High-speed double-sided ultrasound inspection system for power semiconductor samples.
Reflection
12-inch wafer inspection in under 2 minutes, compared with roughly 1 hour for conventional scans.
Automated SAM options
Compare Systems
Use this table to narrow the first conversation before moving into product details.
| Product | Mode | Target | Scan range | Frequency | Evidence |
|---|---|---|---|---|---|
| TSAM Series | Transmission | Package / module | 400(X) x 400(Y) mm | 5 ~ 200 MHz | Result image |
| DUAL FSAM-100 | Double-sided | Power semiconductor | 76 x 70 mm | 5 ~ 200 MHz | Result image |
| RSAM-12 | Reflection | 12-inch wafer | 300 x 300 mm | 5 ~ 200 MHz | Result image |
| USI TSAM 350 | Transmission | Power module | 350(X) x 350(Y) mm | - | Product image |
| USI RSAM 300 | Reflection | Wafer / package | - | - | Product image |
| LUM-300 | Laser ultrasound | Non-contact 3D | 300(X) x 300(Y) mm | - | Result image |
Product Details
Detailed specifications and result images stay below the comparison table so the first screen remains focused.
Scanning acoustic microscopy systems for lab analysis, automated review, and industrial inspection lines.
Ultrasound
Fast SAM platform for high-resolution internal inspection.
Transmission
TSAM-400 is built for through-transmission acoustic inspection when internal layer contrast matters. It supports 5-200 MHz operation, up to 1,000 mm/s scanning, and selectable 1, 2, or 4-channel configurations. That range makes it useful for routine sample review, power semiconductor inspection, and high-resolution defect analysis without changing platforms.
Transmission
TSAM-200 is a compact enclosed transmission SAM system for engineering sample review. The captured system shows a benchtop-style scanner with integrated scan mechanics, internal acoustic fixture space, and on-system scan display, making it suitable for package, component, and small sample inspection workflows.
Double-sided
DUAL FSAM-100 is a fast ultrasound-based non-destructive inspection system for power semiconductor samples. Its self-developed high-speed scanning module supports sample-specific double-sided inspection while balancing imaging penetration and resolution.
Reflection
Reflection SAM platform for sub-surface defect inspection.
Reflection
RSAM-12 is built for fast full-wafer acoustic inspection. Instead of moving across the wafer with a conventional XY scan, the wafer rotates while the transducer moves radially from the center to the edge. The scan path expands by circumference, so a full 12-inch wafer image can be completed in under 2 minutes. The same rotary scanning architecture can be adapted beyond wafers to other samples that can be mounted and rotated. For teams used to scans that take about 1 hour, this changes inspection from a slow review step into a practical screening workflow.
Transmission
USI TSAM 350 automates power semiconductor module inspection with ultrasonic scanning, robotic in/out handling, internal defect analysis, and drying in one workflow. Its key inspection concept is simultaneous top C-scan, bottom C-scan, and through-transmission T-scan imaging, helping teams review upper interfaces, lower interfaces, and full through-body defects without adding a separate X-ray inspection step.
Reflection
USI RSAM 300 is the reflection-mode SAM line represented by the current product asset set. It is kept in the content model as a migration-safe product reference for teams comparing reflection inspection, scan automation, and existing installed workflows.
Real-time ultrasonic scan software for acquisition, signal processing, defect review, export, and automated reporting.
Ultrasound
OHLABS Real-Time Scan Software processes ultrasonic inspection data as scans are acquired, helping engineers analyze defects with faster review speed, accuracy, and workflow efficiency. It supports real-time display, high-speed signal processing, multiple scan modes, gate-based analysis, data export, and automated report generation. The software can be customized for customer-specific inspection recipes, UI workflows, and expandable analysis functions.
Standalone laser-induced ultrasonic microscopy equipment for non-contact, high-precision 3D internal imaging.
Laser ultrasound
LUM-300 is a recently completed standalone Laser-induced Ultrasonic Microscopy system built for non-contact, high-precision internal structure analysis. It uses laser excitation and ultrasonic signal processing to reconstruct 3D inspection data, while the integrated software supports real-time display, multiple scan modes, precision signal processing, smart path optimization, noise filtering, and flexible data export.
Core acoustic hardware used to build and tune inspection systems.
Ultrasound
OHLABS designs, manufactures, and supplies high-frequency immersion ultrasonic transducers for non-destructive inspection systems. Frequency, focal distance, cable, and connector options can be matched to customer samples and inspection conditions, including 40-200 MHz semiconductor inspection applications.
Ultrasound
PR-100 is a compact 1-channel pulser/receiver module for ultrasound inspection benches and integrated scan systems. It provides 150-300 V spike-wave pulsing with front-panel control and pulse-echo or through-transmission receiver operation for basic acoustic inspection workflows.
Ultrasound
PR-300 is a 4-channel spike-wave pulser/receiver module for multi-channel ultrasound inspection benches and integrated scan systems. It provides 150-300 V pulsing, 35 MHz receiver bandwidth, and pulse-echo or through-transmission receiver operation for synchronized acoustic inspection workflows.
Ultrasound
HVPR-300 is a 2-channel high-voltage square-wave pulser/receiver module for ultrasound inspection systems that need dual-mode operation, high receiver bandwidth, and separated channel paths. It supports pulse-echo, through-transmission, and dual-mode receiver operation with 210-300 V pulsing and 200 MHz receiver bandwidth.
Application-specific inspection systems for industrial assets and non-standard sample geometries.
Ultrasound
IPIS-300 is an ultrasonic in-pipe inspection system designed for industrial pipeline integrity monitoring. A circumferential array of 400 ultrasonic sensors scans simultaneously as the tool travels through the pipe, enabling high-density internal wall data acquisition without stopping the run. The modular body, centering wheel structure, and sensor-ring architecture support stable traversal, full-circumference inspection coverage, and defect mapping for wall thinning, internal corrosion, cracks, and structural anomalies.
Inspection Sequence
IPIS-300 travels inside the pipe while circumferential sensor rings acquire ultrasonic data in parallel. The scan builds a pipe-wall map and marks corrosion, wall loss, and crack indications for review.
Pipe Wall Map
400-channel parallel acquisition
Ultrasound
Tailored hardware and software integration for non-standard inspection needs.
Sample Scan Request
Share the material, suspected defect, inspection depth, and preferred output format so the right system and scan recipe can be selected.
